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C-SAM/SAT (Scanning Acoustic Microscope)
C-SAM/SAT delivers non-destructive ultrasound imaging with 5–500MHz bandwidth, 1200mm/s scan speed, and multi-mode operation (manual/semi-auto/auto). SAM Auto Line enables automated defect detection (voids, delamination) for IGBT/MEMS, featuring pallet circulation, auto-review software, and robotic handling—ensuring precise, efficient quality control for semiconductors and medical devices.
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Wire Bonder
• Double drive control mode. • Marble platform. • Welding quality monitoring system. • Nondestructive tensile testing. • Magnetic spring compensation technology. • High pixel GBS device.
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Pin Ultrasonic Welder
This machine replaces soldering processes for semiconductor pins, offering automated needle insertion and welding with high strength and reliability. It requires no cleaning and ensures low resistance. Highlights: Automated positioning and welding up to 1.8kW power. Non-destructive tensile testing for quality assurance. Suitable for pins of 2-25mm² area. Applications: Semiconductor devices, microelectronics, new energy battery modules.
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Terminal Ultrasonic Welder
Excellent welding performance. Wide welding area. Equipped with CCD camera line scanning for automatic positioning and welding. High - precision motion control enables multi - parameter precise regulation. Flexible automation system supporting fast production changeover. Scalable device with customizable function development capabilities. Chinese - language system and user - friendly human - machine interface. Fast delivery and responsive service.
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