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C-SAM SAT Scanning Acoustic Microscope for Semiconductor Inspection
C-SAM/SAT delivers non-destructive ultrasound imaging with 5–500MHz bandwidth, 1200mm/s scan speed, and multi-mode operation (manual/semi-auto/auto). SAM Auto Line enables automated defect detection (voids, delamination) for IGBT/MEMS, featuring pallet circulation, auto-review software, and robotic handling—ensuring precise, efficient quality control for semiconductors and medical devices.
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Wire Bonder for Industrial Welding Applications
• Double drive control mode. • Marble platform. • Welding quality monitoring system. • Nondestructive tensile testing. • Magnetic spring compensation technology. • High pixel GBS device.
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Pin Ultrasonic Welder for Industrial Welding Applications
This machine replaces soldering processes for semiconductor pins, offering automated needle insertion and welding with high strength and reliability. It requires no cleaning and ensures low resistance. Highlights: Automated positioning and
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Terminal Ultrasonic Welder for Industrial Welding Applications
Excellent welding performance. Wide welding area. Equipped with CCD camera line scanning for automatic positioning and welding. High - precision motion control enables multi - parameter precise regulation. Flexible automation system support
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