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MTS Series 3D Topography Measurement System
The MTS Series delivers fast, accurate 3D surface measurement using spectral confocal technology, achieving 20nm Z-axis resolution. Featuring 4-axis automated platform, 6000Hz sampling rate, and intelligent software with Q-DTS/AI integration. Supports multiple materials including transparent, reflective, and rough surfaces. Ideal for semiconductor, automotive, and electronics industries for bump detection, groove measurement, and surface analysis with exceptional precision and efficiency.
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MTS Series Spectral Confocal 3D Topography Measurement System
The MTS Series utilizes advanced spectral confocal technology for non-contact 3D surface measurement, achieving exceptional Z-axis resolution up to 20nm. Featuring linear motor platforms with 0.1μm precision, automated scanning capabilities, and multi-material compatibility. Supports various applications including semiconductor bump inspection, groove measurement, and laser mark analysis. Integrated with proprietary software and AI algorithms for efficient data processing and real-time reporting. Ideal for precision manufacturing quality control in electronics, automotive, and semiconductor industries.
MTS Series Spectral Confocal 3D Topography Measurement System High-Speed Automated Metrology Solution 3D topography measurementSend Email Details
