AX9500 Vision Series 3D Offline Inspection System

Introduction to the AX9500 Vision Series

The AX9500 Vision Series represents a breakthrough in non-destructive 3D industrial inspection, combining cutting-edge X-ray imaging technology with intelligent software for precise internal defect detection. Designed for applications ranging from microelectronics to automotive manufacturing, this system leverages a high-power open X-ray source (160kV maximum) and advanced reconstruction algorithms to deliver sub-micron resolution. Its offline operation mode ensures flexibility for laboratory and production environments, providing comprehensive analysis without disrupting workflow efficiency. As part of Unicomp Technology’s portfolio (Stock Code:531), the AX9500 meets rigorous international standards, including FDA radiation safety guidelines, making it a trusted solution for sectors demanding uncompromising quality assurance.

Core Technical Specifications

The AX9500 integrates a robust X-ray imaging system capable of 2D, 2.5D, and 3D imaging modes. Key specifications include:

• X-Ray Source: Open-type design with 160kV maximum voltage and 15W power output, enabling deep penetration for dense materials.

  
  

• Detector: High-definition flat-panel detector (FPD) ensuring clarity for fine details.

  
  

• Image Resolution: ≤1μm, allowing detection of micron-scale defects such as cracks or voids.

  
  

• Magnification: 2500X standard, extendable to 7500X composite magnification for detailed analysis.

  
  

• Stage System: A large loading area of 580mm (X) × (Y), with maximum 3D inspection zones of 470mm × 500mm (PCT mode) and 100mm × 200mm (ACT mode). The stage supports weights up to 10kg (PCT) or 500g (ACT with standard fixtures).

  
  

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Application Areas and Case Studies

The AX9500 serves diverse industries:

• Electronics: Inspects BGA, CSP, flip-chip, and LED components for soldering defects or voids. For instance, it identifies micro-cracks in semiconductor packages, reducing failure rates in consumer electronics.

  
  

• Automotive and New Energy: Analyzes aluminum die-castings, molded plastics, and battery components for porosity or inclusions, ensuring reliability in electric vehicles.

  
  

• Specialized Sectors: Handles ceramics and composite materials, detecting internal flaws that compromise integrity.

  
  

Case examples include 3D scans of automotive parts revealing hidden cracks, and 2D/2.5D inspections of PCB assemblies highlighting solder bridging. The system’s versatility allows it to adapt to unique sample geometries, supported by customizable software templates.

#### Safety and Compliance

Safety is embedded in the design: radiation leakage is controlled below 0.5μSv/h—well under the 1μSv/h FDA limit—through shielded enclosures and interlock systems. The emergency stop button halts all operations immediately, while the safety lock disables the X-ray source if doors are opened during use. These features, coupled with Unicomp’s certifications (e.g., CE, ISO), make the AX9500 suitable for regulated environments like medical device manufacturing.

Advantages Over Conventional Systems

Compared to traditional 2D X-ray systems, the AX9500 offers:

• Higher Accuracy: 3D tomography provides volumetric data, eliminating blind spots in complex assemblies.

  
  

• Efficiency: Automated navigation and CNC programming reduce inspection time by up to 50%, with batch processing capabilities.

  
  

• Adaptability: The open architecture allows integration with external software for data analysis, catering to R&D and quality control needs.

  
  

With its combination of precision, safety, and flexibility, the AX9500 Vision Series empowers industries to enhance product reliability while minimizing operational risks.

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