thermal shock test chamber
  • Thermal Shock Test Chamber

    Thermal Shock Test Chamber

    Types: Two-zone (Basket-type), Three-zone (Valve-type) Purpose: Simulates instant drastic temperature change environments for testing chips, military products, and other components requiring resilience to thermal shock. Features: Rapid Temperature Transition: High-temperature zone heats up to 180℃ in <15 minutes; low-temperature zone cools down to -70℃ in <50 minutes. Safety Mechanisms: Equipped with explosion-proof chain design and safety lock devices to prevent accidental opening during extreme temperature cycles.

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